There are four important steps for pivotal technologies in industrialization of power LED chip:
1. To boost the holistic power by increase the working current;
2. To improve transition efficiency for photoelectricity by adopting new-style packaging structure;
3. To enhance the lighting efficiency by designing new chip structure;
4. To lower the Tj( junction temperature) of chips in case of high current by using materials with great heat conduction and optical property.

    These four steps are indispensible and closely related, they work together to promote the extensive industrialization of power LED and make it the core of semiconductor lighting.

    As one of the High-end brands admitted by LED industry, Semileds chip is qualified with high cost performance and the following advantages:

①Great lighting efficiency and high luminous intensity;
②Fast heat dissipation and low lumens depreciation ;
③Apply to low voltage and high current rush.

    The research of power LED components started from 1990s, super brightness InGaAIP red-yellow and InGaN blue-green component develop successful with rapid development,providing the foundation for the power component development.First is the HP company make the GaP wafer direct bond with InGaAIP red-yellow LED chips,manufacture Piranhas high power LED component with transparent substrate.Its forward current of 70mA, dissipation power greater than 150mW, the top highest quantum efficiency more than 50%, and the luminous efficiency of 6111nm wavelength can reach 102lm/W.
    At the beginning of this century, HP company launched TS inverted trapezia struchture power large area chips.It's working current can be enlarged to 500mA with over 60lm luminous intensity.Working at pulse mode, the lumen can reach 140lm.
    Germany Oseam company developed a new generation power LED chips at 2001 by fabricating texture structure on the surface of component.This new LED chips gain more than 50% quantum efficiency, it with the similar basic performance of TS structure LEDs.At present,this component production technology has been greatly simplified and can batch production.
    With regard to GaN blue-green component,American Lumileds company had developed the flip chip structure power LEDs sucessful.When it with 1A forward current and 3.3V forward voltage,the output power can be reach 400mW.According to the reliability tests show that the performance of this component is very stable.
    At the same time, American Cree company developed back light power AIGalnN/SiC LED chip struture. With 0.9mm*0.9mm size, this component adopt of * type electrode. When the working current is 400mA, its output power can reach 250mW.
    Taiwan is one of the main areas of develop and produce all kinds LED components in the world.After the UEC developed GB high power InGa-AIP LEDs,Para Light developed white light and other color lights power LED component as well, and make them in the mass production. These components can drive 150mA without additional heat can reach 4-6lm and 2-4lm to red-yellow light and blue-green light.
    By 2004,there are almost 3500 enterprises,more than 500,000 employees in LEDs industry,the producivity of LED components over 40 billion/year, more than 30 billion RMB in LED market.At present the market mainly concentrated in the pearl river delta and the Yangtze river triangle area and other manufacturing developed area, its market share take up more than 95% of all kinds of LED application market.

    99% of the domestic LED enterprises are engaged in the LED packaging and import the chips. Since the "Ninth Five-Year Plan", the domestic LED technologies have made great progress by transforming techniques, making techological breakthrough, bringing in advanced facilities. LED chip manufacturing industry has been equiped with the ability of LRIP(Low Rate Initial Production) for GaAs & GaP monocrystal and Gap & Al GaAs rheotaxy.
    In recent years, the average growth rate of domestic LED industry is above 30%. In 1998, it realized industrial scale with 3500 million output value, 6500 million pieces production and 2244 million sales revenue.
    Among mess of manufacturers, there are about 20 packaging factories and nearly 300 small and medium-sized business in PRD(The Pearl River Delta). As to the chip manufacturers, there are only 5 factories that can provide batches of chips in the amount of 1000KK/month which is still in short supply.

    The first picturephone meeting was held by NSLP leading group on June 17th, 2003 which marked the start of National LED Lighitng Project.
    " China International Forum on LED Lighting 2004" was hosted by the leading group and CALI(China Association of Lighting Industry) on March 22nd, 2004 which established the following four LED lighting bases: Shanghai, Xiamen, Dalian and Nanchang. In April 2005, Shenzhen had become the fifth National LED lighting base. The production value of LED in Shenzhen had surpassed 5000 million, and the value of some enterprises had reached 1000 million. There are about 300 enterprises distribute in the upper, middle and lower reaches of LED industry chain.The "Guideline of Developing High Tech Industrialization First in Important field", published by SDPC(State Development Planning Commission) and MOST(Ministry of Science and Technology), pointed out that"the power LED is photoelectric and new electronic display device, it is the national priority support project. The red,green, yellow epitaxial wafer of In, Ga, Al, and As is the main material for high brightness LEDs and it is the key industry supported by our country.

    LED lighting has been basically promoted and mainly used in commercial and household illumination . As to the reason that causes the damage of LED, it is because the inner part of LED chip is injured by current. The specific reasons are as following:

1. The voltage rises suddenly. There are many factors that lead to the rise of voltage, such as the quality of power supply or the misemploy of the users;
2. Partially cutting-out of the LED circuit caused by the short cut of some components or wires will rise the voltage;
3. The cutting-out caused by its own quality may transfer the voltage to the other LEDs;
4. Extremely high inner temp. will deterioratev the specialitiesof LEDs;
5. The cutting-out will come into being when the light is filled with water;
6. Even though the LED light is working under the normal voltage and current, the internal part is also damaged because of the imperfection of anti-static preperation.

　As a result of the above reasons, the current will rise and the LED chip will be burnt due to the high temp. in conventional practice, there are two situations when one LED is burnt: firstly, it has very slight impact on other LEDs and drivers, but the burnt one will not work; another situation is that the cutting-out will make other LEDs burn because of the high current, besides, the power supply will also be damaged. So in a word, it is very important and essential to protect the LEDs. Core strength / core force.

    I believe everyone know clear to " LED packaging technology", especially there are have many of news coverage about new LED packaging factory in recenet years. LED packaging is to protect the LED chip from the external environment and enhance the effect of the capacity of heat-transmission,moreover, it also can improving the light-extraction efficiency of LED chips, to achieve the specific optical distribution and make th visble light output.
    So, how many packaging ways to LEDs? Summend up, there are 5 different packages as below:
1. Pin type (lamp) LED packages.
2. Surface mount (SMD) type (SMT-LED) package.
3. Cache on board (COB) LED packahe.
4. System in package type (SIP) LED package.
5. LED wafer bonding and LED chip bonding.

    LED junction temperature have highly related to P-N of Semiconductor,rigidly, P-N of semiconductor defined as the temperature LED junction temperature.As to the small size of LED semiconductor,P-N junction temperature will rise when the current through the LED chip components,so the LED chip temperature look as LED junction temperature.
    LED semiconductor P-N is by the LED chip internal P type semicondutor connected to N type semiconductor. When the LED lighting,the P-N of LED chip through current, the temperature will go up, lead to the temperature of LED chip rise.With the temperature of LEDs chip rise,it will come out the big challenge to the lumen of LEDs lighting sourse and LED lifespan.
    Due to the high brightness,low power consumption,long lifespan,energy saving and environmentally friendly, LED products are widely applied to roadway lighting,family interior lighting,public lighting, LED display, LED advertising,automotive lighting,instruments, etc.